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MSOP-10-1EP_3x3mm_Pitch0.5mm.kicad_mod
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MSOP-10-1EP_3x3mm_Pitch0.5mm.kicad_mod
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(module MSOP-10-1EP_3x3mm_Pitch0.5mm (layer F.Cu) (tedit 57AFAE31)
(descr "MSE Package; 10-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081664_I_MSE.pdf)")
(tags "SSOP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MSOP-10-1EP_3x3mm_Pitch0.5mm (at 0 2.55) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.15))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.15))
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.15))
(fp_line (start -2.8 -1.8) (end -2.8 1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.8 -1.8) (end 2.8 1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 -1.8) (end 2.8 -1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 1.8) (end 2.8 1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.625 -1.625) (end -1.625 -1.475) (layer F.SilkS) (width 0.15))
(fp_line (start 1.625 -1.625) (end 1.625 -1.3775) (layer F.SilkS) (width 0.15))
(fp_line (start 1.625 1.625) (end 1.625 1.3775) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end -1.625 1.3775) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.475) (end -2.55 -1.475) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.6 0.6) (thickness 0.15)))
)
(pad 1 smd rect (at -2.105 -1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.105 -0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.105 0) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.105 0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.105 1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.105 1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 2.105 0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 2.105 0) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.105 -0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.105 -1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 11 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 11 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 11 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(model ${KISYS3DMOD}/Housings_SSOP.3dshapes/MSOP-10-1EP_3x3mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)