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HTSSOP-20-1EP_4.4x6.5mm_Pitch0.65mm_ThermalPad.kicad_mod
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HTSSOP-20-1EP_4.4x6.5mm_Pitch0.65mm_ThermalPad.kicad_mod
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(module HTSSOP-20-1EP_4.4x6.5mm_Pitch0.65mm_ThermalPad (layer F.Cu) (tedit 5892182E)
(descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias")
(tags "HTSSOP 0.65")
(attr smd)
(fp_text reference REF** (at 0 -4.3) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value HTSSOP-20-1EP_4.4x6.5mm_Pitch0.65mm_ThermalPad (at 0 4.3) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.2 -3.25) (end 2.2 -3.25) (layer F.Fab) (width 0.1))
(fp_line (start 2.2 -3.25) (end 2.2 3.25) (layer F.Fab) (width 0.1))
(fp_line (start 2.2 3.25) (end -2.2 3.25) (layer F.Fab) (width 0.1))
(fp_line (start -2.2 3.25) (end -2.2 -2.25) (layer F.Fab) (width 0.1))
(fp_line (start -2.2 -2.25) (end -1.2 -3.25) (layer F.Fab) (width 0.1))
(fp_line (start -3.95 -3.55) (end -3.95 3.55) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.95 -3.55) (end 3.95 3.55) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.95 -3.55) (end 3.95 -3.55) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.95 3.55) (end 3.95 3.55) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.23 3.45) (end 2.23 3.45) (layer F.SilkS) (width 0.12))
(fp_line (start -3.75 -3.45) (end 2.23 -3.45) (layer F.SilkS) (width 0.12))
(pad 21 thru_hole rect (at 1.3 -2.6) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at 0 2.6) (size 1.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at 0 1.3) (size 1.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at 0 -2.6) (size 1.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at 0 -1.3) (size 1.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.8 0.8) (thickness 0.15)))
)
(pad 1 smd rect (at -2.95 -2.92) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.95 -2.27) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.95 -1.62) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.95 -0.97) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.95 -0.33) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.95 0.33) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.95 0.97) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.95 1.62) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -2.95 2.27) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -2.95 2.92) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.95 2.92) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.95 2.27) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 2.95 1.62) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.95 0.97) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.95 0.33) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.95 -0.33) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 2.95 -0.97) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 2.95 -1.62) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 2.95 -2.27) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at 2.95 -2.92) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
(pad 21 thru_hole rect (at 0 0) (size 1.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at -1.3 -2.6) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at -1.3 -1.3) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at -1.3 0) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at -1.3 1.3) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at -1.3 2.6) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at 1.3 2.6) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at 1.3 1.3) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at 1.3 0) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(pad 21 thru_hole rect (at 1.3 -1.3) (size 0.8 1.3) (drill 0.3) (layers *.Cu *.Mask))
(model ${KISYS3DMOD}/Housings_SSOP.3dshapes/HTSSOP-20-1EP_4.4x6.5mm_Pitch0.65mm_ThermalPad.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)